| Capability of Rigid board | ||
| No. | Type | Standard |
| 1 | Normal FR4/Halogen free/ High Tg FR4/ Aluminum | KB，Shengyi, ITEQ,Isola, Nelco,Ventec,Tuc,Elite, Panasonic, Getek,NanYa, Bergquist,laird |
| 2 | PTFE Laminates | Rogers series、Taconic series、Arlon series、Nelco series、 Taizhou Wangling F4BK series、TP series; |
| 3 | Hybrid laminating | Rogers/Taconic/Arlon/Nelco laminate with FR-4 material - including partial Ro4350B hybrid laminating with FR-4 |
| 4 | Layers | 1-64 layers, board thickness 0.4mm-10mm |
| 5 | Buried/Blind Via | 4-50 layers, board thickness 0.5mm-10mm |
| 6 | HDI | 1+N+1、2+N+2、3+N+3、Anylayer HDI |
| 7 | Flex & Rigid-Flex PCB | 1-12layers Flex PCB ,2-20layers Rigid-flex PCB HDI+Rigid-flex PCB |
| 8 | Soldermask Type(LPI)/ Soldermask color | kuangshun,Taiyo、 Himonia,Nanya,Onstatic,Chung Yu,MSDS/Green, Yellow, Black, Blue, Red, White,Purple,Orange , Matte Green,Matte Blue, Matte Black |
| 9 | Peelable Soldermask/color | PETER SD2955/Blue-Green |
| 10 | Carbon ink | Nipon |
| 11 | HASL/Lead Free HASL | Thickness: 0.5-40um |
| 12 | OSP | Entek Plus HT, Preflux F2 LX |
| 13 | ENIG (Ni-Au) | Au:0.03um≤max＜0.06um Ni:3um≤max≤6um |
| 14 | Electro-bondable Ni-Au | Au:0.2-1.0um Ni:2.54-10um |
| 15 | ENEIPG | Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm |
| 16 | Electro. Hard Gold | Au:5~50uin(0.125~1.27um); Nithickness:100~250uin (2.50~6.25um) |
| 17 | Thick tin | 1.0-1.4um |
| 18 | Copper thickness | 12oz max. |
| 19 | Min Mechanical Drill Hole | 0.15mm |
| 20 | Min. Laser Drill Hole | 4mil (0.100mm) |
| 21 | Line Width/Spacing | 2mil/2mil |
| 22 | Max. Panel Size | 650mm X 1200mm |
| 23 | Line Width/Spacing Tolerance | Non electro coating:+/-5um，Electro coating:+/-10um |
| 24 | PTH Hole Tolerance | +/-0.002inch(0.050mm) |
| 25 | NPTH Hole Tolerance | +/-0.002inch(0.050mm) |
| 26 | Hole Location Tolerance | +/-0.002inch(0.050mm) |
| 27 | Hole to Edge Tolerance | +/-0.004inch(0.100mm) |
| 28 | Edge to Edge Tolerance | +/-0.004inch(0.100mm) |
| 29 | Layer to Layer Tolerance | +/-0.003inch(0.075mm) |
| 30 | Impedance Tolerance | +/- 10% /Max >50ohm +/- 5% |
| 31 | Warpage % | Max ≤0.5% |
| Capability of Rigid-flex board | ||
| No. | Item | Standard |
| 1 | Flex & Rigid-Flex PCB | 1-30layers Flex PCB , 2-20layers Rigid-flex PCB HDI+Rigid-flex PCB |
| 2 | FCCL(adhesive) | Shengyi SF305:PI=0.5mil&1mil&2mil; Cu=0.33oz&0.5oz&1oz |
| 3 | FCCL(adhesiveless) | Panasonic R‐ F775(ER): PI=1mil&2mill; Cu=0.33oz&0.5oz &1oz |
| DuPont Pyralux AP:PI=1mil&2mil&3mil; Cu= 0.5oz&1oz | ||
| 4 | Coverlay | Shengyi SF305C: 0515&0525&1025&2030 |
| 5 | Adhesive | Taiflex BT: AD=10um& 25um& 40um |
| shengyi SF302B: AD=35um&40um | ||
| 6 | PI stiffener | Taiflex MHK: PI=3mil, 5mil, 7mil and 9mil |
| 7 | 3M | 9077&6677&9458 |
| 8 | NO FLOW PP | Ventec:VT‐47N(TG 170℃)& EM‐285B(TG 150℃) |
| 9 | CCL | ITEQ: IT‐ 180A; Shengyi: S1141& S1000‐2 |
| 10 | Other CCL | Arlon: 85N; Rogers: RO4000 series; Nelco:N4000‐ 13 series, Ventec:VT‐901 |
| 11 | Board thickness | 0.3mm‐ 3.0mm |
| 12 | Tolerance of board thickness (thickness＞1.0mm) | ±10% |
| 13 | Tolerance of board thickness (thickness≤1.0mm) | ±0.1mm |
| 14 | Min. board size | 10mm*15mm |
| 15 | Max. board size | 406.4mm*558.8mm |
| 16 | Impedance control tolerance | ±10% |
| 17 | Bow&twist | 0.75%(symmetrical), 2%(unsymmetrical) |
| 18 | Min. BGA pad size | 12mil(8mil for electrical soft gold board) |
| 19 | Max. finished copper thickness | 3oz |
| 20 | Max. buried via | 0.4mm |
| 21 | Tolerance of non‐ plated holes | ±2mil(limited is +0/‐2mil or +2/‐0mil) |
| 22 | Solder mask color | green,blue,red, matte green, and so on |
| 23 | Min. solder dam (copper≤1oz) | 4mil(green, red and blue), 5mil(black and white) |
| 24 | Min. solder dam (copper2‐4oz) | 8mil |
| 25 | Min. clearance | 2.5mil (2.0mil) |
| 26 | Surface treatment | HASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold,Hard Gold, Immersion silver, Immersion tin and OSP |
| Thickness (ENIG) | 0.05‐0.10um | |
| 27 | Nickel thickness (ENIG) | 3‐ 8um |
| Gold thickness (ENEPIG) | 0.05‐0.10um | |
| 28 | Palladium thickness (ENEPIG) | 0.05‐0.15um |
| Nickel thickness (ENEPIG) | 3‐ 8um | |
| 29 | Hard gold thickness (leadless) | 0.1‐ 1.5um |
| Hard gold thickness | 0.1‐4.0um | |
| 30 | Electrolytic Nickel thickness | ≥3um |
| Electrolytic Gold thickness | 0.05‐0.10um | |
| 31 | Immersion silver thickness | 0.2‐0.4um |
| OSP thickness | 0.1‐0.3um | |
| 32 | Tolerance of board outline | ±6mil(exclude complicated board outline and cutout) |
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